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horizontal electroless copper

  • Electroless Copper Plating Equipment Products

    Electroless copper plating has some advantages such as simple equipment easy to operate without power supply and current density control problems so copper layer with uniform thickness and high quality can be deposited on the irregular surfaces and insulator surface.

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  • OKUNO CHEMICAL INDUSTRIES CO. LTD │ Metal Finishing

    Okuno s metal finishing department manufacutures and sells electroless plating products chemicals for PCBs aluminum plastic. Also we manufacture and sell product to improve corrosion resistance for decoration and various functional plating.

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  • The next revolution in electroless copper for advanced

    Berlin September 3 2018 Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating.The new process Printoganth® RA is compatible with electro-deposited copper (ED) rolled and annealed (RA) as well as "super-flexible RA" (HA) copper foils

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  • PC Electroless Copper Transene

    Continuous mild agitation of work. Nominal plating rate 0.2 mil/hour. PC Electroless Copper is used for depositing thin layers of copper up to 0.5 microns. For thicker films Transene Copper Plating Acid Type should be used after initial electroless copper deposition. The copper content is 16 grams/gallon. Thru-Hole Plating Instructions

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  • CHEMCUT ATOTECH ANNOUNCE RELEASE OF NEW HORIZONTAL

    Mar 09 2006 · March 09 2006. FOR IMMEDIATE RELEASE March 9 2006. CHEMCUT ATOTECH ANNOUNCE RELEASE OF NEW HORIZONTAL ELECTROLESS COPPER PROCESSING SYSTEM. State College PA Chemcut Corporation and Atotech USA Inc. announce the release of a new market-sized Horizontal Electroless Copper Processing System designated the Model 990D.

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  • CIRCUPOSIT™ 6530 catalyst process for electroless copper

    This paper describes the development of a new ionic palladium catalyst CIRCUPOSIT™6530 Catalyst along with a tartrate-based horizontal electroless copper bath CIRCUPOSIT™6550 to meet the

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  • CHEMCUT ATOTECH ANNOUNCE RELEASE OF NEW HORIZONTAL

    Mar 09 2006 · March 09 2006. FOR IMMEDIATE RELEASE March 9 2006. CHEMCUT ATOTECH ANNOUNCE RELEASE OF NEW HORIZONTAL ELECTROLESS COPPER PROCESSING SYSTEM. State College PA Chemcut Corporation and Atotech USA Inc. announce the release of a new market-sized Horizontal Electroless Copper Processing System designated the Model 990D.

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  • Dow Electronic Materials Interconnect Technologies Product

    • Thin deposit eless copper process ELECTROLESS COPPER BATHS (HORIZONTAL) CIRCUPOSIT™ 3350-1 • Advanced self-accelerating copper EDTA-based suitable for horizontal applications • Fine-grained deposit ideal for high performance multilayers and HDI (High Density Interconnection)applications

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  • Pretreatment for Copper Electroless Plating on

    Pretreatment for Copper Electroless Plating on Tantalum Substrate Seung Hwan Cha Chang Hwa Lee and Jae Jeong Kim Research Center for Energy Conversion and Storage School of Chemical Engineering Seoul National University Shillim-dong Kwanak-gu Seoul 151742 Korea With decreasing feature size in integrated circuit

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  • Liew Ming ShianPlating Process Development Manager

    Perihal. Process Engineering background with more than 11 years of working experience in demanding and challenging manufacturing environment which has cultivated an ambitious and result-oriented team player and the ability to lead a team of junior engineers technicians trainers and operators to execute action plans for yield improvement and cost reduction activities.

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  • Troublean expert system for trouble-shooting the

    Troublean expert system for trouble-shooting the electroless copper plating process (Technical Paper) R Heindryckx on Amazon. FREE shipping on qualifying offers.

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  • Atotech Introduces Printoganth RA Electroless Copper Process

    Printoganth RA horizontal electroless copper process was developed to ensure blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating. Is compatible with electro-deposited copper (ED) rolled and annealed (RA) and "super-flexible RA" (HA) copper foils.

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  • │ Treatment Chemical for

    Acid Copper Plating Acidic Cleaner Activator Additive For Electro-polishing To Stainless Steel Alkaline Type Electroless Nickel Plating Solution Batch Application Type Catalyzer Composite Electroless Plating Solution Conditioner Continuous Replenishing Type Cyanide-free Chelate-free Electrolytic Cleaner Cyanide-free Electrolytic Cleaner

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  • Barrel Plating Barrel Plating Services Industrial

    Copper plating nickel plating electroless nickel phosphorous palladium plating palladium-nickel silver plating tin tin-lead Horizontal barrels are the most frequently used largely because they are capable of handling larger volumes and greater varieties of workloads. The largest type of horizontal barrel known as a production

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  • The next revolution in electroless copper for advanced

    Sep 03 2018 · Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating.The new process Printoganth® RA is compatible with electro-deposited copper (ED) rolled and annealed (RA) as well as "super-flexible RA" (HA) copper foils and best suited to meet

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  • Printoganth® P Plus Atotech

    Printoganth ® P Plus is Atotech s most versatile electroless copper process for horizontal application. Favorable internal stress characteristics of the electroless copper deposit are resulting in excellent adhesion even on smoothest substrates and non-blistering performance of the process.

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  • Electroless nickel on copperFinishing

    Sep 08 2010 · Electroless nickel on copper September 8 2010. Q. Right now we plate electroless nickel on steel and aluminum but our customer has a new request electroless nickel on copper somebody know wich is the best way to apply EN on copper Gabriel Ramirez GDO plating shopGuadalajara Mexico

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  • WCU410 Series Electroless Copper/Microetch Controller

    3.4 Flow Through Copper Sensor/Sample Loop Installation The copper flow through sensor is designed for out-of-tank monitoring of electroless copper and microetch solutions. The sensor is designed with a glass tube that contains the copper solution that forms a

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  • Atotech Launches Next Revolution in Electroless Copper for

    Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating. The new process Printoganth RA is compatible with electro-deposited copper (ED) rolled and annealed (RA) as well as "super-flexible RA

    Get Price
  • PCB platingEngineering Technical -PCBway

    PCB plating a variety of surface coating process instance. PCB in the production process in order to meet the requirements of the board the need to use a variety of surface coating process such as hole metal copper nickel gold electroless nickel electroless gold plating organic flux protective film and electroplating tin-based

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  • Horizontal Electroless CopperPCB Shop

    Horizontal Electroless Copper . Model Printoganth SAP Plus U U Plus P Plus. Category Materials and Chemicals for PCB / Chemicals for PCB / Alkaline Palladium Base Electro-Less Copper Process Characteristics . Printoganth SAP Plus process chemistry in combination with Uniplate equipment gives superior adhesion on bare resins coupled with an extremely good surface distribution. This makes

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  • (PDF) Horizontal Reel to Reel Copper Plating with InPulse 2

    Horizontal Reel to Reel Copper Plating with InPulse 2 material with electroless copper . hydrate layers using hot water injection using horizontal wells including a production well and

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  • MID-Plating-Line (barrel and rack) GALVABAU AG

    Oct 31 2016 · Automatic MID-line barrel and rack plating (electroless copper-nickel-gold) Line set-up 1 line 34 processing positions incl. 5 storage positions 1 side arm hoist with drip tray Flightbars with horizontal stroke movement Electroless copper Electroless nickel (incl. storage tank with fixed pipes) Electroless gold 1 load/unload station 1 dryer

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  • │ Treatment Chemical for

    Acid Copper Plating Acidic Cleaner Activator Additive For Electro-polishing To Stainless Steel Alkaline Type Electroless Nickel Plating Solution Batch Application Type Catalyzer Composite Electroless Plating Solution Conditioner Continuous Replenishing Type Cyanide-free Chelate-free Electrolytic Cleaner Cyanide-free Electrolytic Cleaner

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  • Properties of electroless Cu films optimized for

    A production-level electroless copper bath designed for horizontal plating was characterized. • In-situ stress evolution of the Cu(Ni) films was studied with XRD and via substrate curvature. • Stress of the Cu films depends on substrate choice (metal or ABS polymer). • Stress and its relaxation are inversely proportional to film thickness

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  • MID-Plating-Line (barrel and rack) GALVABAU AG

    Oct 31 2016 · Automatic MID-line barrel and rack plating (electroless copper-nickel-gold) Line set-up 1 line 34 processing positions incl. 5 storage positions 1 side arm hoist with drip tray Flightbars with horizontal stroke movement Electroless copper Electroless nickel (incl. storage tank with fixed pipes) Electroless gold 1 load/unload station 1 dryer

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  • Electroless copper depositionEurocircuits

    Electroless copper deposition. The first step in the plating process is the chemical deposition of a very thin layer of copper on the hole walls. The operator clamps the production panels into the jigs. The line is fully computer controlled and the panels are carried through

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  • Complex Chemistry the Electroless Copper Plating Process

    The deposition rate and deposit properties of electroless copper plating depend on the copper complexing agent reducing agent bath temperature and pH.11 In addition additives such as stabilizers accelerators and brighteners Complex Chemistry the Electroless Copper Plating Process by J. Li P.A. Kohl Corresponding Author Dr. Paul A. Kohl

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  • PERFEKTO The Leading Technology in

    The Leading Technology in The ultimate improvement in the Electroless copper PTH technology. The Perfekto Electroless Copper (P.E.C.) is formulated for stable operation and easy to control. The deposition and horizontal applications. PERFEKTO S.F. is the unique optimised process maxi-

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  • Horizontal Electroless Copper Products MacDermid Enthone

    MacDermid Enthone M-Copper EF is the only electroless copper system on the market that is sold by an international plating supplier which can outperform local suppliers at a competitive price.M-Copper EF is specifically formulated from decades of experience with electroless copper plating and modern innovations to allow for a revolution in quality and service in a segment of the PCB industry

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  • HORIZONTAL METHOD OF ELECTROLESS METAL PLATING OF

    Aug 31 2017 · Horizontal methods of electroless metal plating with ionic catalysts have improved plating performance by reducing undesired foaming. The reduced foaming prevents loss of ionic catalyst from the catalyst bath and prevents scum formation which inhibits catalyst performance.

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  • (PDF) Horizontal Reel to Reel Copper Plating with InPulse 2

    Horizontal Reel to Reel Copper Plating with InPulse 2 material with electroless copper . hydrate layers using hot water injection using horizontal wells including a production well and

    Get Price
  • Horizontal Electroless CopperPCB Shop

    Horizontal Electroless Copper . Model Printoganth SAP Plus U U Plus P Plus. Category Materials and Chemicals for PCB / Chemicals for PCB / Alkaline Palladium Base Electro-Less Copper Process Characteristics . Printoganth SAP Plus process chemistry in combination with Uniplate equipment gives superior adhesion on bare resins coupled with an extremely good surface distribution. This makes

    Get Price
  • Electroless Copper Plating Surface Engineering

    Electroless or autocatalytic metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces regardless of size and shape. The plating s ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper

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  • Mini Electroplating Plants Tabletop Lines Technic Inc.

    Technic Mini Electroless Copper Line Tabletop Mini-Plants Bulletin. Designed for small scale testing of copper plating of PCBs plating. Standard Features. Seven (7) polypropylene tanks 10 ½" x 6 ½" x 11" deep (3 gallon) One (1) Stainless steel tank 10 ½" x 6 ½" x 11" deep (3 gallon) with one (1) 500 watt Teflon heater with

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  • PTH horizontal / Plating horizontal Hofstetter PCB Plating

    PTH horizontal / Plating horizontal. The electrolytic copper plating takes place in a horizontal plant the Segmenta. This plant operates with pulse plating achieving very good copper distribution on the surface. Outstanding results are achieved with the copper plating of blind microvias using special flooding elements.

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